The Path To 1tb/S And Beyond Datacenter Interconnect Networks: Technologies, Components And Subsystems

METRO AND DATA CENTER OPTICAL NETWORKS AND SHORT-REACH LINKS IV(2021)

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摘要
Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, datacenters suffer from increasing number of interconnections dictating the deployment of novel architectures and high-radix switches. The ratification of 400 GbE standard is driving the market of optical transceivers nevertheless, a technology upgrade will be soon necessary to meet the tremendous traffic growth. In this paper, we present the development of 800 Gb/s and 1Tb/s optical transceivers migrating to 100 Gbaud per lane and employing wafer-scale bonding of InP membranes and InP-DHBT electronics as well as advanced co-packaging schemes. The InP membrane platform is also exploited for the development of novel ultra-fast optical space switches based on a modular architecture design for scaling to large number of I/O ports.
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关键词
datacenter interconnects, photonic integration, co-packaged optics, wafer-bonding, InP membranes, InP-DHBT electronics, 1Tb/s transceivers, optical space switches
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