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Blistering Kinetics in H-implanted 4H-Sic for Large-Area Exfoliation

Current Applied Physics(2021)SCI 3区SCI 4区

Indian Inst Technol Delhi | Corning Inc | Natl Inst Mat Sci

Cited 6|Views11
Abstract
Layer transfer of single-crystalline SiC based on layer splitting and wafer bonding on an alternate substrate is a viable approach to fabricate SiC power devices at a lower cost. Dependence of implantation-induced surface blistering and exfoliation of thin layers, on the implantation parameters and subsequent annealing conditions, for large area exfoliation of 4H-SiC have been studied. We report the optimization of the annealing process (one-step or two-step) and annealing parameters like temperature and time to achieve large area exfoliation of SiC. Using the Fo center dot ppl-von Karman (FvK) theory, the pressure inside the blister cavities and implantation-induced stress inside the damage region have been studied. We deduce that pressure inside the blister depends primarily on the blister size. HRXRD analysis has been used to determine the strain relaxation behavior as a function of annealing conditions. Raman spectroscopy and STEM measurements revealed the formation of defects inside the material due to ion implantation. AFM, Nomarski, and SEM were used to measure the size and depth details of the blisters as a function of annealing temperature and time. We have successfully exfoliated large area (up to 500 mu m) in a two-step annealing process. The results reported in this paper are useful for SiC layer transfer on an arbitrary substrate by the Smart Cut process.
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4H-SiC,Blistering,Ion implantation,Smart cut process,Strain,Large-area exfoliation
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要点】:研究了大面积剥离4H-SiC的动力学过程,优化了退火工艺和参数,实现了基于离子注入和层裂技术的低成本单晶SiC层转移。

方法】:利用Fo center dot ppl-von Karman理论分析了水泡内部压力和损伤区域内的植入诱导应力,通过HRXRD、Raman光谱和STEM测量了材料内部的应变松弛行为和缺陷形成情况。

实验】:采用AFM、Nomarski和SEM技术研究了退火温度和时间对水泡大小和深度的细节影响,并在两步退火过程中成功剥离出大面积(达500微米)的SiC层,使用了特定数据集但未明确提及数据集名称。