Design of a GaN HEMT based inverter leg power module for aeronautic applications

This paper presents the design of an inverter leg power module using GaN HEMT power components, and dedicated to aeronautical transports domain. This module has been designed collectively between industrial and academic partners, considering the thermal, electrical and thermomechanical aspects while co-developing the component and the package. The environment of the transistors is especially adapted to GaN materials for high frequency and high temperature operating by, among other thing, adapting the power components surface and bringing closer the decoupling capacitors and the control system. The first part of the paper describes the original part of the module, the second one is focused on the electrical and EMI aspects, the third part presents thermal simulations and the last one describes the thermomechanical analysis of the structure.