Aluminum Chloride Reveals The Catalytic Activity Towards Laser-Induced Deposition Of Copper From Water-Based Solutions

Catalytic actions of aluminum chloride on laser-induced liquid-phase copper deposition process were studied. Copper deposition experiments in aqueous solutions containing aluminum chloride upon 532 nm laser irradiation at different line deposition rate were performed. The influence of pH on the deposition rate and topology of the deposited copper microstructures was investigated. Enhanced rate of copper reduction in aluminum chloride solutions was observed. High purity copper microstructures with good electrical conductivity were obtained.