Thermally Stable Single-Mode Glass Waveguides With Fiber Connectors For Co-Packaged Optics

Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (IOX) single-mode waveguides for photonic integrated circuit (PIC) packaging and fiber cable connectivity is demonstrated in an effort to reduce the overall packaging complexity. The single-mode glass waveguides were fabricated and evaluated to be thermally stable at 110 degrees C for more than 5 years. Laser singulated optical end-facets and laser-formed passive alignment features yield an average connector loss of 0.68 dB when end-coupled to standard MTP-16 (TM) connectors.