Self-Reducible Copper Complex Inks With Two Amines For Copper Conductive Films Via Calcination Below 100 Degrees C

Herein is described a new method for the fabrication of copper conductive films at temperatures of less than 100 degrees C. This method uses self-reducible copper complex inks and two types of amines. Copper complex inks with only 3-butylpyridine are capable of self-reducing at temperatures below 100 degrees C, but the process is accompanied by the formation of cracks that results in metallic copper films that are highly resistive. The combination of 3-butylpyridine and dipmpylamine in self-reducible copper complex inks prevents the generation of cracks via the connection of self-reduced copper particles in the film, which results in low volume resistivity.