Modeling Finite Dielectric Structures Embedded in Layered Medium for IC Packages and Boards

2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)（2021）

引用 0|浏览0

暂无评分

摘要

A novel and efficient methodology to analyze interconnect structures where finite 3D dielectric structures are embedded in a layered dielectric background is presented. The methodology is validated for some scenarios commonly arising in electromagnetic characterization of electronic packages and printed circuit boards.

查看译文

关键词

Three-dimensional displays,Conferences,Printed circuits,Integrated circuit interconnections,Silicon,Dielectrics,Green's function methods

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要