High yield and process uniformity for 300 mm integrated WS2 FETs

We demonstrate an integrated process flow on full 300mm wafers with monolayer WS2 channel. WS2 is a 2D semiconductor from the transition metal dichalcogenide family and holds promise for extreme gate length scaling. We report here on integration challenges and optimize process uniformity for a single-device yield higher than 90% across wafer. These transistors and integration flow are shown to be compatible with H2 anneal of at least 400 C and hence in principle suitable for hybrid integration in the BEOL.