A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules

Solder joints play a significant role in modern electronic packaging; however, the presence of process-induced voids within a solder layer remains a crucial concern to the reliability and performance of interconnects. Porosity (i.e., void fraction of solder layer), void size, void location, and void distribution are key factors affecting the thermal characteristics of power modules. A quantitative...