Evaluation of Thermal Resistance for Underfill Layer in Three-dimensional Stacked ICs by Transient Thermal Analysis Makoto SASAKI, Ryo KIKUCHI,Taiji SAKAI,Seiki SAKUYAMAJournal of Smart Processing(2018)引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要