Recent Trends in Wafer-Level Package Technology
2020 IEEE MTT-S International Wireless Symposium (IWS)(2020)
摘要
The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.
更多查看译文
关键词
eWLB,heterogeneous integration,SiP
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要