Thermal deformation behavior of GO/CeO2 in-situ reinforced Cu30Cr10W electrical contact material

•The GO/CeO2-Cu30Cr10W composites was prepared by freeze-drying and spark plasma sintering.•The Cr7C3 nanoparticles were formed at the rGO/Cu interface to enhance the interfacial bonding strength.•The addition of GO, CeO2 and twinning mechanism increased the flow stress and activation energy.•With the increase of deformation temperature, the HAGBs increases and main texture changes to fiber texture.•The introduction of GO/CeO2 reduces the rheological instability region.