Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness

The demand for integrated silicon packages is driving packaging advancements for increasingly fine circuit pattern designs. The integration of processors, graphics, and controllers on die results in large die-sizes and increased I/O. Patterning defect inspection limitations are likely to impact yield assessment and quality validation on the substrate/interposers for advanced packages. iNEMI initiated the project “Fine Pitch Circuit Pattern Inspection Metrology for High Volume Manufacturing (HVM)” readiness in 2016. This is the 3rd phase focused on examining the measurement capability on fine line and space below 10um copper patterns on an organic material-set panel. Test vehicles (TV) were designed with fine pitch pattern trace widths and incorporated known defective fine-featured wiring to comprehensively examine Automated Optical Inspection (AOI) capability to handle differences in organic material properties such as color, reflectivity, and surface roughness as well as substrate warpage and shape deformation. This paper presents results for production-level AOI capability.