Counterflow HE analysis of Cu and SiO2 nanofluids in the developing flow region

Three concentrations of 0.2, 0.6, and 1.0 vol.% Copper/25 nm and silica/22 nm nanofluids are prepared in a base liquid glycerol-water mixture of 30:70 ratio by volume (GW70). The thermophysical properties of Cu and SiO2 nanofluids are determined with a TPS500S hot disc thermal analyzer and Brookfield viscometer in the temperature range of 20-80 degrees C. The maximum enhancement in Cu and SiO2 nanofluid viscosity (63.4%, 35.7%), thermal conductivity (100.4%, 71.3%), and density (7.5%, 1.5%) while specific heat (7.8%, 2.3%) determined for 1.0% concentration at 80 degrees C compared to base liquid GW70. Heat transfer experiments are conducted in a short-length double pipe heat exchanger. The flow rates resulted in the lamifnar entry length region. A maximum enhancement in the overall heat transfer coefficient (HTC; 25.0%, 19.7%) and convective HTC (46.2%, 34.8%), respectively for Cu and SiO2 nanofluids is estimated at 1.0% concentration compared to base liquid at a bulk temperature of 35 degrees C.