A Novel Non-Contacting Single-Coil Electromagnetic Hole Expansion Process to Improve the Fatigue Performance of Hole Component

In this study, a novel non-contacting electromagnetic cold expansion process (SEMCE) was developed to improve the fatigue life of hole component. The deformation mechanism and residual stress distribution around the hole during the SEMCE process was investigated by numerical simulation. Fatigue tests were performed to evaluate the strengthen effect of the SEMCE process. The surface topology and material microstructures near the hole wall were investigated by SEM and TEM. Results showed that the SEMCE process could significantly improve the fatigue performance of 2A12-T4 specimen. The SEMCE specimen showed good surface integrity, and grain refinement was observed near the hole.