A scalable digital platform for the use of digital twins in additive manufacturing

Manufacturing Letters(2022)

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摘要
While Additive Manufacturing promises to reshape the manufacturing landscape, challenges related to part, and process qualification hinder its widespread adoption. The Instance-Qualified approach seeks to qualify individual parts, even for processes with high variability, by leveraging the concept of a digital twin. This work proposes a scalable cyberphysical infrastructure to enable the construction and use of such digital twins. This work also introduces the concept of an Augmented Intelligence Relay, which allows Artificial Intelligence algorithms to predict component performance for a given application even when it is impractical to perform a large number of physical tests.
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关键词
Additive manufacturing,Digital twin,Artificial intelligence,Instance-qualified,Cyberphysical infrastructure
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