Research on Ni(3)Sn(4 )Intermetallic Compound for 5 mu m Diameter Cu/Ni/Sn-3.0 Ag Micro Bumps

for 5 mu m diameter micro bumps, the interfacial intermetallic compounds (IMCs) seriously affects the interconnection performance of micro bumps. In this paper, we focused on the discussion of the growth and control mechanism of IMCs of 5um diameter micro bumps at different temperatures and durations. The growth mechanism and morphology of Ni3Sn4 IMC was studied. Through the EDS analysis of the cross-sectional micro bumps, it could be determined that the composition of the slender columnar crystal IMC was Ni3Sn4. When the heating temperature was higher than the melting point of Sn-3.0wt%Ag solder, the IMC would exhibit uneven and abnormal growth along the Sn grain boundary. Furthermore, the IMC growth and diffusion mechanisms of solid-solid and solid-liquid interface reaction were discussed respectively. Finally, based on the temperature and duration of the growth and evolution of the Ni3Sn4 IMC, we gave appropriate suggestions for the use of small-sized micro bumps.