Enhanced thermal conductance and electrical insulation of AlN/PMIA composite paper via nano splitting of matrix and size grading of fillers

Poly-(meta-phenylene isophthal-amide) (PMIA) is regarded as an ideal insulating medium for electronic devices owing to its excellent chemical stability and breakdown strength. However, the poor thermal conductivity limited the application under complex electrical-thermal environment. In this work, the size-graded AlN/PMIA composite papers were fabricated, with a multi-scale structure of matrix and fillers, and maintain qualified stability, mechanical strength and electrical insulation properties. With doping 40 wt% of 10 μm AlN and 10 wt% of 200 nm AlN, the optimum paper with in-plane (λ∥) and out-of-plane (λ⊥) of optimal paper reached thermal conductivity of 17.3 W/(mK) and 1.96 W/(mK) is obtained, and the breakdown strength increased to 69 kV/mm. The improvement mechanism brought by size-graded fillers was further revealed by the co-simulation of finite element method and loop nesting algorithm.