Molecular Dynamics Simulation on Wetting of Silver Nanosolder on a Diamond Surface

Analyzing the wetting behavior of silver on adiamond substrate is crucial prior to joining and printing diamondchips in electronics, bioimplants, and cutting tool industries. Thispaper used molecular dynamics models to overcome the hydro-phobic behavior. It was observed that the hydrophilic character waswell promoted when a nanosolder block of silver was collided at acertain velocity on a diamond substrate in a hydrodynamic staterather than when it was stationary and then heated on diamond.Hydrodynamic wetting led to rapid spreading, which in turnelucidated a high rate of change in contact area to the highest11 832 A2and a high rate of decrease in contact angle to the lowest23 degrees at the highest contact velocity of 19.7 km/s in minimum time.Therefore, hydrodynamic wetting has a leading margin for silvercoating on diamond surfaces over temperature, slab separation, and hydrostatic wetting. This paper provides theoretical insights foreffective thin-film development in the least possible time and with the lowest solder consumption.