Thermal-aware routing algorithm in partially connected 3D NoC with dynamic availability for elevators

3D Network on Chips (NoCs) have been widely used in recent years to improve the performance comparing 2D NoCs. They employ TSVs to connect different layers in the stack of layers of the network. Since the fabrication cost of these TSVs is an important challenge in 3D NoCs, most of them are partially connected. In this paper a thermal-aware routing algorithm is proposed to uniform thermal distribution in a partially connected NoC. In the proposed algorithm, routing procedures are performed based on the measured temperature of routers in each cycle. 3D routers propagate an index that shows their location and distance to other routers. The value of these indexes have been dynamically updated to be proportional to the temperature of the routers. Employing this method causes the 3D router to receive fewer packets with higher temperatures, which reduces the possibility of creating a hotspot. Also, 2D routers are prevented from overheating by powering off them during the inner-layer routing. The simulation results show that the proposed routing outperforms related thermal-aware routing algorithms by 50% network latency reduction, while the power consumptions reduced at least 9%.