In-situ photonic circuit field characterization in electronics-photonics CMOS platform via backside flip-chip near-field scanning optical microscopy

Conference on Lasers and Electro-Optics(2022)

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摘要
We demonstrate device field c haracterization u sing N SOM c ollection a nd in-teraction measurement modes via the backside buried-oxide of large scale photonic circuits fabricated in monolithic electronics-photonics CMOS platforms (here a microdisk resonator) post-processed using flip-chip substrate-removal.
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关键词
electronics-photonics CMOS platform,backside flip-chip near-field scanning,device field characterization,interaction measurement modes,backside buried-oxide,scale photonic circuits,monolithic electronics-photonics CMOS platforms,flip-chip substrate-removal,in situ photonic circuit field characterization
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