Microstructure and Reliability of Tin-Silver Micro-Copper Pillar Assemblies

Abstract IBM engineers recently conducted a study to better understand and control the reliability of copper pillar solder joints in 2.5-D packages. Here they describe their approach and the results they obtained. They explain how they created test samples to evaluate different solder compositions, pillar geometries, and thermal histories and assess their effect on microstructure, precipitate morphology, intermetallic layer thickness, and shear strength. They also present thermal cycling test results comparing the performance of silicon and glass interposers.