Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics

•This study proposes a PDMS-GO nanocomposite-based microfluidic heatsink as an alternative thermal management option for flexible electronics.•The GO nanoparticles up to 5 % w/w concentration could be uniformly mixed with PDMS and thermally cured to achieve structural rigidity.•The incorporation of 5 % w/w GO nanoparticles can enhance the thermal conductivity and elasticity of the PDMS by a margin of 2.5-fold and 3-fold.•The numerical simulation illustrates that the flow rate tuning accelerates the heat transfer characteristics of PDMS-GO based microfluidic heat sinks devices compared to PDMS devices.