Study on combining technology of thin film process and multilayer alumina ceramic process

Based on thin film technology and multilayer alumina ceramic technology, a multilayer alumina ceramic package combined with thin and thick films was prepared. The research contents include the use of thin film process to prepare interconnect lines on the surface of the multilayer alumina ceramic package, and to realize the differential plating of thick gold and thin gold of metallized patterns in different regions. The research results show that the surface line density can reach 10μm line width and line spacing, the plating thickness of the thick gold area on the surface layer is 2~3μm, and the plating thickness of the thin gold area on the surface layer is 0.5μm. Finally, various reliability verification tests were carried out on the prepared multilayer alumina ceramic package, and the test results meet the requirements of the indicators. The combination of the thin film process and the multi-layer alumina ceramic process can meet the needs of complex layout ，high-density and multi-function for microsystem packaging in the future.