Polynomial based surrogate modeling of interconnection configuration and signal transmission performance of double C-type gold ribbon in microwave modules

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)(2022)

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摘要
With the rapid development of electronic information technology towards high-speed, big data, strong robustness and intelligence, the development of microwave modules, the core component of electronic systems, is constantly facing new severe challenges. For a long time, the influence mechanism of microwave module interconnection structure and electrical performance transmission index is not clear, which has become the core factor restricting the development of high-performance microwave modules. Therefore, in this paper, firstly, the parameterized characterization modeling of double C-type gold ribbon is carried out through the parabola function, then the significance ranking of configuration parameters is carried out by using the experimental design method, and the key parameters are selected. Finally, the polynomial based surrogate model is established by using the response surface method, and its accuracy is verified. Thus, it provides theoretical guidance for the interconnection design and optimization of microwave modules in engineering.
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关键词
signal transmission performance,interconnection configuration,microwave,c-type
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