Die-embedded glass packaging for 6G wireless applications

This work presents the design and fabrication of an antenna-integrated glass package with embedded die for D-band (110–170 GHz) wireless applications. The proposed package uses glass as the core material, in which dies are embedded. The redistribution layer (RDL) for electrical connections is fabricated on low-loss polymeric build-up films (ABF-GL102). The vertical interconnects between the dies and the package are implemented using laser-drilled micro-vias. The RDL supports two metal layers which include an 8-element series-fed microstrip patch antenna array. With micro-vias and transmission lines integrated into the low-loss polymer, the die-embedded glass package provides low-loss and low-parasitic die-to-die and die-to-antenna interconnects. Graphical abstract