Crumpled Graphene Epoxy Nanocomposites Modified with Polydopamine for Advanced Semiconductor Packaging Applications

Graphene-based epoxy nanocomposites are effective TIMs due to the unique properties of graphene - extraor-dinarily high thermal conductivity and large specific surface area. However, graphene easily aggregates due to strong van der Waals interactions and has poor interfacial connections due to a smooth surface. In this work, a facile method fabricates highly crumpled graphene nanosheets. The crumpled architecture prevents graphene nanosheets from restacking and maintaining the high specific surface area. Polydopamine (PDA) is used to promote uniform dispersion of graphene through pi-pi bonds, reducing the thermal interface resistance. Addi-tionally, it enhances the thermal transport between as a TIM as proved by experimentation and modeling. The resultant 2.5 wt% filler loading epoxy nanocomposites present a high through-plane thermal conductivity of 1.02 W/mK. They also have a low CTE, low viscosity, low moisture absorption, high electric resistivity, and high adhesion strength. These results provide insights into the design of graphene-based epoxy nanocomposites to meet TIMs requirements in high density 3D electronic packaging.