The Delamination Caused by Flux Residue in System-in-Package Devices

Andrei Alaferdov,Ricardo Yoshioka, Carolina C. P. Nunes, Matheus Dias Sousa, Valdeci Carvalho,Igor Fernandes Namba,Claudemir Coral

2022 36th Symposium on Microelectronics Technology (SBMICRO)（2022）

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摘要

The problem of delamination in system-in-package devices was studied. It was found that this type of failure was induced by solder flux excess trapped underneath electronic components and/or around the big solder area. Several approaches to solve this problem were proposed.

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关键词

flux residue,delamination,system-in-package,underfill

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