Characterizing Aging Degradation of Integrated Circuits with a Versatile Custom Array of Reliability Test Structures
2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)(2022)
摘要
This work presents an integrated circuit array with custom test structures for the characterization of aging phenomena that includes three types of commonly-used circuits: inverters, single-stage amplifiers, and current mirrors. The array allows the characterization of these circuit blocks through a wide variety of metrics and different accelerated stress and operating conditions. This characterization clearly shows the stochastic nature of aging and the importance of a dedicated test structure to fully understand it at the circuit level.
更多查看译文
关键词
Aging,Bias Temperature Instability,Hot Carrier Injection,Circuit Reliability
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要