Evaluation of BEOL scaling boosters for sub-2nm using enhanced-RO analysis

Anita Farokhnejad,Simone Esposto,Ivan Ciofi,Odysseas Zografos,Pieter Weckx,Julien Ryckaert,Pieter Schuddinck,Yang Xiang,Zsolt Tokei

2022 IEEE International Interconnect Technology Conference (IITC)（2022）

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摘要

In this work, the impact of metal hybrid height (H^2) and airgap (AG) scaling boosters are evaluated based on an enhanced Ring Oscillator (RO) framework that accounts for Place and Route (PnR) aspects of the back end of line (BEOL) interconnects. When targeting best performance, extended AG with high aspect ratio (AR) lines appears to be the optimal choice as it allows reducing both capacitance (C) and resistance (R). Combining AG with H^2 provides minimum C at an increased R making it more suitable for power optimization.

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关键词

Ruthenium semidamascene,interconnect scaling boosters,hybrid height,airgap,extended airgap,enhanced RO

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