Diversifying the role of MI in semiconductor manufacturing through new technologies and innovations

Historically, the development of high-density ICs has been a series of challenges, and we have overcame them and finally succeeded in mass production. However, the time from initiating product development to mass production is increasing, and moreover, it is taking longer than ever to reach maximum production yields. In this manufacturing environment, reducing development and yield ramping-up time is the most important factor in maximizing productivity and profit, and the key solution for this is MI technology. However, in order to respond to next-generation semiconductor products based on complex 3D structures, MI technology is going beyond the requirements especially for highly localized and non-destructive monitoring of 3D profiles. In this paper, we will discuss the evolutionary direction of these MI solutions. First, we will define the MI challenges that come along with the structural difficulties of new product, and review the changes in technology that have evolved in each field to overcome them. We will also explore the limitations of these technologies and see what new methodologies can be nominated to overcome them. We'll also look at what technical elements are required for HVM and what lessons can be learned from the examples in real production. Finally, we will propose how semiconductor MI technology should change its role through new innovations.