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Design and Displacement Sensitivity Analysis of Micro Scale Piezoresistive Cantilever

Satyanarayana Talam, Dhruva Kollu, Shaik Haniff, Lokesh Pavan Nallamothu, Shaik Ayesha Begum,Rambabu Busi

2022 Second International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT)(2022)

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摘要
The present investigation is aimed at modelling of piezoresistive cantilever beam to evaluate the displacement by means of optimizing the dimensions, materials (p-silicon, Silicon carbide, Silicon) and the shape to realize the better performance. The optimized cantilever has been modelled with rectangular in shape by exploring the displacement through boundary load ranging from 20 to 100pa. Among three materials, the p-silicon has shown the maximum displacement than that of other materials under 40pa boundary load. The maximum displacement is observed 9.19x10-9μm and minimum displacement is -5.94x10-5μm respectively. From the analysis of all these results, the optimization will be carried only for the p-silicon material and getting the maximum displacement for the boundary loads of 40 Pa over the other materials. For implementing this, COMSOL Multiphysics software of version 5.0 is used.
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关键词
Cantilever,displacement sensitivity,Piezoresistive,COMSOL V 5.0
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