Online Correction Method of IGBT Lifetime Evaluation Based on Bonding Wire Failure Monitoring

Insulated gate bipolar transistor (IGBT) modules are widely used as power switching devices. In actual working conditions, the failure of bonding wires is one of the most important failure modes. At present, the influence of bonding wire failure is not considered in the reliability evaluation of the device, resulting in a large error in the life prediction result. Therefore, this paper proposes a life evaluation method for IGBT modules that takes into account the failure of the bonding wire. The transient thermal impedance of 1200 V/50 A IGBT module under the failure conditions of different numbers of bonding wires is calculated by constructing a finite element simulation model of device electro-thermal coupling. Both simulation and experimental results show that with the increase of the number of bonding wire failures, the transient thermal impedance curve of the device rises and the steady-state thermal impedance increases. The Foster thermal network models of the devices are updated, and the number of power cycles of the device with bonding wire failure under DC and sinusoidal pulse width modulation (SPWM) conditions is calculated. When the number of bonding wire failures and fatigue accumulation have a linear relationship, the life will be reduced by 48.29% compared to the healthy state.