Confined IMCs for low temperature and high throughput D2W bonding

Jaber Derakhshandeh,Douglas Charles La Tulipe,Giovanni Capuz,Vladimir Cherman,Carine Gerets, Tom Cochet,Ehsan Shafahian,Inge De Preter,Geraldine Jamieson,Tomas Webers,Eric Beyne,Gerald Beyer,Andy Miller

2022 International Conference on Electronics Packaging (ICEP)（2022）

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摘要

In this paper an integration flow is introduced for IMC insertion bonding, enabling stacking microbumps with 10um and below pitches. Confined CoSn3 pre-IMC bumps inside the cavities prevent lateral IMC growth and provide mechanical connection between Sn and sharp IMC grains during low temperature TCB process and improve the alignment. Electrical yield of 95% is obtained for single bumps connection of 20, 10 and 7um pitch bumps.

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关键词

Confined CoSm IMCs,Die to wafer stacking,low temperature TCB

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