Low Power High Bandwidth Acceleration Sensor For Industrial Applications
2019 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)(2019)
摘要
This paper reports on the improved micromechanical structures and improved integrated electronics to create high bandwidth acceleration sensors with a high signal to noise ratio and very low power electronics. This ambitious aim can be achieved by a very close co-design of MEMS and ASIC. Our two axis micromechanical element is optimized with respect to its seismic mass, which is needed to have an ultra-low noise sensor. Therefore, a large height of the micro mechanical structure is preferred. Another aim is a very high capacitive sensitivity while keeping the base capacitance as small as possible to aim for a small power consumption. Hence, a high aspect ratio technology is essential.
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关键词
MEMS,2-axis,sensor,acceleration,vibration,high bandwidth,BDRIE,analog/mixed signal ASIC,low power
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