The Path Towards Realistic ASIC Electronics Deployment Into Previously Impractical Extreme Application Environments
2022 Device Research Conference (DRC)(2022)
摘要
Substantial expansion of the practical environmental envelope for integrated circuit (IC) operation offers important benefits to a variety of automotive, aerospace, deep-well drilling, and manufacturing applications [1]. ICs that can reliably operate for long time periods (years) in a harsh environment without degradation or need of diagnostic/maintenance intervention enable the largest benefits compared to IC technologies requiring added shielding, cooling, remote-location, maintenance, or other overhead to perform beneficial system functions. The ability to “cold-start” at low temperature (T ≤ −55°C) and continuously function through “warm-up” to extreme temperature is also important to most applications. Fig. 1 illustrates the massive difference between a Venus lander mission that relies on sheltering electronics from the caustic 91-atmosphere pressure 460°C surface environment (600 kg lander that returns data for less than a day) compared to the mission possible with electronics that can function for long duration without need of environmental sheltering (20 kg lander that operates for 60 days) [2], [3].
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关键词
substantial expansion,practical environmental envelope,integrated circuit operation,deep-well drilling,manufacturing applications,long time periods,harsh environment,IC technologies,beneficial system functions,extreme temperature,Venus lander mission,sheltering electronics,environmental sheltering,91-atmosphere pressure,surface environment,ASIC electronics deployment,impractical extreme application environments,temperature -55.0 degC,temperature 460.0 degC,mass 600.0 kg,mass 20.0 kg,time 60.0 d
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