56 GBd high power InP EAM chip for hybrid integration

Jan Gregor Gatzmann,Martin Moehrle,Ute Troppenz,Ariane Sigmund,Martin Schell

2022 28th International Semiconductor Laser Conference (ISLC)（2022）

引用 0|浏览11

暂无评分

摘要

We demonstrate an InP EAM chip with high (> 5 mW) fibre-coupled output power, large (> 35 GHz) bandwidth, and wide (>15 nm) wavelength range. The BH device includes integrated amplifiers with spot size converters at in- and output supporting hybrid integration with e.g. tunable lasers or PICs.

查看译文

关键词

hybrid

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要