Research on the influence mechanism and modification technology of UV-curing adhesive on the HPLD thermal-induced misalignment

The demand for output performance and reliability of the HPLD (high-power laser diode) has become increasingly stringent with the development of application requirements. The thermal effect of the HPLD will lead to optical components' thermal-induced misalignment, which will significantly affect the output quality and power of the laser. In this paper, the influence of the thickness and uniformity of UV-curing adhesive on the thermal induced misalignment of the bonding module is revealed. Then the thermal stability of UV-curing adhesive is optimized by the microparticles composite modification method. Finally, the single emitter array laser is packaged with the optimized modified UV-curing adhesive, the thermal-induced misalignment of beam-shaping components can be reduced by 8 times, and the power reduction ratio of the laser is reduced from 3.8% to 0.72%. This research supports efficient control of the thermal-induced misalignment which to ensures high-performance packaging and manufacturing for HPLD.