Optimizing AsSeGe Chalcogenides by Dopants for Extremely Low I-OFF, High Endurance and Low V-th Drift 3D Crosspoint Memory

H. Y. Cheng,W. C. Chien,I. T. Kuo,C. H. Yang,Y. C. Chou,R. L. Bruce,E. K. Lai, D. Daudelin,C. W. Yeh, L. Gignac,C. W. Cheng, A. Grun,C. Lavoie,N. Gong,L. Buzi,H. Y. Ho, A. Ray, H. Utomo, M. BrightSky, H. L. Lung

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)(2021)

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摘要
The doping effect on AsSeGe OTS materials is comprehensively studied. While B, C, S doped selectors suffer a stringent trade-off among V-th, I-OFF and cycling endurance, Si and In doped selectors demonstrate an extremely low V-tS (system threshold voltage when PCM is in SET state) and V-tR (system threshold voltage when PCM is in RESET state) drift characteristics. We demonstrated true crosspoint operation (by half-V scheme) in a 1k by 1k cross-point ADM memory arrays from an In doped AsSeGe selector integrated with PCM with extremely low I-OFF (similar to 3nA from a total 100 crosspoint cells), wide V-tS/V-tR memory window (similar to 2V main distribution memory window), 1E6 write cycles and low V-ts and V-tR drift characteristic (project<0.3V and 0.5V, respectively for one year) which is suggested for 3D crosspoint memory technology.
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关键词
3D crosspoint memory technology,AsSeGe/ss,cross-point ADM memory arrays,crosspoint cells,crosspoint operation,cycling endurance,doping selector,extremely low IOFF,In/el,low vth drift 3D crosspoint memory,main distribution memory window,OTS materials,PCM,RESET state,SET state,Si/el,system threshold voltage,tR drift characteristic,tR memory window,voltage 0.5 V
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