Editorial for the Special Issue on Advanced Interconnect and Packaging.

Micromachines(2023)

引用 1|浏览6
暂无评分
摘要
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation [...].
更多
查看译文
关键词
advanced interconnect,packaging
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要