Solderable conductive paste for electronic textiles

Journal of the Taiwan Institute of Chemical Engineers(2023)

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摘要
•A solderable conductive adhesive is developed for screen-printing conductive patterns on textiles.•The paste remains good flowability at high filler loading and shows a great conductivity without sintering.•The printed conductive patterns have a thermal endurance and possess great wettability to solder melt.•The conductive adhesive provides good shear strength and peel strength with intermetallic layer between solder.•Screen-printed patterns on textiles show good fidelity and electrical interconnectivity with solder joints.
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关键词
Electronic textile,Electronic packaging,Low-temperature curing,High fillers,Dispersion,Solderability
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