Effect of a water film on the material removal behavior of Invar during chemical mechanical polishing

Wan Wang,Dongpeng Hua,Qing Zhou,Shuo Li,Stefan J. Eder,Junqin Shi,Zhijun Wang,Haifeng Wang,Weimin Liu

Applied Surface Science（2023）

引用 14|浏览21

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摘要

•Elucidation of water-assisted polishing mechanism for Invar.•Rolling abrasiveschange the pattern of atomic motion in the surface layer.•Passivation effect ofwater improvesgroove surface quality.•There exists anoptimal parameter combination for low-damage machining.

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关键词

Chemical mechanical polishing,Water film,Molecular dynamics simulation,Surface roughness,Subsurface damage

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