Reshaping System Design in 3D Integration: Perspectives and Challenges

Hung-Ming Chen, Chu-Wen Ho,Shih-Hsien Wu, Wei Lu,Po-Tsang Huang, Hao-Ju Chang,Chien-Nan Jimmy Liu

ISPD '23: Proceedings of the 2023 International Symposium on Physical Design（2023）

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摘要

In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.

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关键词

3D Integration, Fast system prototyping, 3D interconnection architecture, D2D design

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