"3-D Printed Rectangular Waveguide 123-129 GHz Packaging for Commercial CMOS RFICs" (vol 33, pg 157, 2023)
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS(2023)
关键词
Wireless communication,Microwave technology,Rectangular waveguides,Production,Packaging,CMOS technology,Radiofrequency integrated circuits
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要