Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys

Shaoyu Li,Xingrui Luo,Zhe Sun, Huarui Zhou,Shiyu Xiong,Baixiong Liu,Longfei Zeng,Bin Yang

Materials Letters（2023）

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摘要

•A specially designed dual heterogeneous lamella structure (DHLS) was produced.•DHLS consists of soft micrograined inside ultrafine grains.•The ultrafine grains contain nano-sized precipitates.•The DHLSed alloy shows excellent mechanical property and electrical conductivity.

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关键词

Dual heterogeneous lamella structure,Cu based materials,Strength-electrical conductivity,Back-stress strengthening

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