2D characterisation and evaluation of multi-material structures towards 3D hybrid printing

Multi-material manufacturing through the hybridisation of printed electronics and additive manufacturing has gained great interest recently. However, such hybridisation attempts are not trivial due to the need for functional material development and compatible process identification, as well as further performance understanding, comprehensive characterisation and long-term reliability evaluation of multi-material parts. While some multi-material structures from functional materials such as silver inks have been demonstrated via the integration of direct writing systems into stereolithography or material extrusion platforms, the performance assessment and characterisation of parts manufactured using such integrated systems is still required. Therefore, this research presents a comprehensive assessment of multi-material structures manufactured using syringe deposition and material extrusion platforms. Test specimens were subjected to various characterisation activities such as thickness measurement, resistance measurement, roughness tests, wettability measurement, adhesion tests, and morphological analysis. Results and statistical analyses suggested that the dry thickness and conductivity of deposited films were dependent on the substrate material. Adhesion between the conductive film and substrate was affected by both substrate material and ink deposition angle. Also, the interaction of conductive films with polycarbonate substrate was found to be noticeably better among all substrates due to low resistivity and enhanced adhesion at low thicknesses.