Low Insertion Loss 128-Gbaud HB-CDM with 3D-Printed Spot Size Converter Integrated InP-based Modulator

Yasutaka Mizuno,Munetaka Kurokawa,Naoki Itabashi,Taichi Misawa,Masaru Takechi,Hiroshi Uemura, Hajime Tanaka,Tsutomu Ishikawa, Tomoya Saeki,Keiji Tanaka,Takatoshi Kato,Manabu Shiozaki,Katsumi Uesaka

2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC（2023）

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摘要

We demonstrate 128 Gbaud HB-CDM with InP based modulator having 3D -printed SSCs on chip facet. Optical coupling loss of 1.1 dB and Telcordia compliant reliability promise practical usage of 3D -print technology based on two photon polymerization. (c) 2022 The Authors

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