Polymer-based semiconductor wafer cleaning: The roles of organic acid, processing solvent, and polymer hydrophobicity
Chemical Engineering Journal(2023)
摘要
•Polymer-based wafer cleaning via flake formation and peeling off phenomenon.•Theoretical simulations according to thermodynamics-based particle removal mechanism.•Analyses of cleaning efficiency according to organic acid, solvent, and substrate.•Effective nanoparticle removal on both low-k and high-k wafers.
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关键词
Wafer cleaning, Polymers, Nanoparticles, Organic acids, Processing solvent, Flakes
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