Dynamic Force Modeling of Wire Saw Machining Processes

Abstract Wire saw machining is extensively used to cut hard and brittle materials because of the resulting narrow kerf size, low cutting forces, and minimal material waste. The change of cutting forces strongly affects the part surface quality. Current models compute static machining forces based on the process variables and cutting conditions. This paper builds a dynamic machining force model that includes the effect of the wire tension and describes how the force changes as the wire engages with the part and as the wire changes direction due to reciprocation. Machining of silicon monocrystal parts is used to experimentally validate the proposed dynamic force model. The results show a very good correlation between the simulated and experimental data. The model captures the transient effect of the machining forces as the wire becomes fully engaged with the part and it is able to capture the fluctuations in the normal force, which is due to the changes in wire tension, as the wire reciprocates.