Enhanced thermal performance from liquid metal in copper/graphite filled elastomer
Journal of Materials Science & Technology(2023)
摘要
With the increasing integration level of modern electronics, thermal management becomes an urgent issue for guaranteeing the work efficiency and lifespan of electronics. On the basis of intrinsic high ther-mal conductivity nature, highly ordered graphite and copper stripes are densely aligned in the silicone gel pads in vertical (VCuGr) and oblique (@15 degrees CuGr) directions to couple the high thermal conductivity and mechanical softness. The wetting nature of liquid metal (LM) on the chemically treated Cu surface is utilized to form a LM layer on the two surfaces of thermal pads. The obtained LM-pad TIMs possessed ultrahigh through-plane thermal conductivity (VCuGr: 71.4 W/(m K), @15 degrees CuGr: 62.5 W/(m K)) under the normal packaging pressure. The thermal resistance decreased from 0.69 cm2 K/W to 0.25 cm2 K/W with the surface modification with LM. Theoretical simulation and practical thermal dissipation test results further demonstrate the excellent thermal management capability of these composites in high-power electronics.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
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关键词
Vertical copper, graphite, High thermal conductivity, Liquid metal modification, Low thermal resistance, Excellent thermal management
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